New wafer plants to lift revenue to US$5.5b
Print Edition
THE Chinese mainland’s semiconductor equipment market revenue is set to reach US$5.5 billion this year as new plants will be built, industry officials said yesterday.
The new plants or expanded production lines unveiled recently include Intel’s wafer plant in Dalian, TSMC’s plant in Nanjing and UMC’s plant in Xiamen. Each of them costs at least US$5 billion.
Shanghai is expected to use 30 billion yuan (US$4.6 billion) from a semiconductor fund of 50 billion yuan for a new wafer plant.
In 2016, the semiconductor wafer fab equipment (WFE) market revenue will hit US$5.5 billion, up from US$4.7 billion in 2015 and US$4.4 billion in 2014, said Semi, a semiconductor industry association.
Liu Erzhuang, general manager of Lam Research China, said: “The overseas semiconductor capacity is moving to the Chinese mainland to tap the huge market of consumer electronics.”
Chips are widely used in smartphones, TVs, computers, electronics and cars.
Lam Research, the No. 3 WFE vendor globally, plans to build new plants or upgrade and expand facilities in Shanghai, Beijing, Xian, Wuhan and Dalian.
In October, Intel unveiled an extra investment of US$5.5 billion to upgrade a wafer plant in Dalian. TSMC, or Taiwan Semiconductor Manufacturing Corp, also said it will build a 12-inch wafer plant in Nanjing, the first Taiwan-invested 12-inch plant on China’s mainland.
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